Guest Editorial: Special Issue Based on Papers Submitted to All 2018 IEEE TEMS Conferences

Xiaohong Iris Quan; Max von Zedtwitz

doi:10.1109/TEM.2021.3053849

Guest Editorial: Special Issue Based on Papers Submitted to All 2018 IEEE TEMS Conferences

Xiaohong Iris Quan^*, Max von Zedtwitz

^*Corresponding author for this work

Department of International Economics, Government and Business

San Jose State University

Research output: Contribution to journal › Editorial › peer-review

Abstract

The papers in this special issue were submitted to all the conferences organized by IEEE Technology and Engineering Management Society (TEMS) in a given calendar year. In 2017, IEEE TEMS initiated its flagship conference TEMSCON (held in Silicon Valley), which serves as rebranding from its original International Technology Management Conferences (ITMC). Following that, in 2018, two more conferences were initiated globally, one in Asia known as IEEE TEMS International Symposium on Innovation and Entrepreneurship (ISIE), and one in Europe as IEEE TEMS International Conference on Technology and Entrepreneurship (ICTE). For this special issue, we invited authors attending any of the three aforementioned conferences in 2018 to submit full manuscripts for reviews, and the present special issue with eleven papers is the result of a careful selection following our usual rigid double-blinded peer-review process.

Original language	English
Article number	9520682
Journal	IEEE Transactions on Engineering Management
Volume	68
Issue number	6
Pages (from-to)	1543-1545
Number of pages	3
ISSN	0018-9391
DOIs	https://doi.org/10.1109/TEM.2021.3053849
Publication status	Published - Dec 2021

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@article{c37c71d5aac34f17948357ed99d02912,

title = "Guest Editorial: Special Issue Based on Papers Submitted to All 2018 IEEE TEMS Conferences",

abstract = "The papers in this special issue were submitted to all the conferences organized by IEEE Technology and Engineering Management Society (TEMS) in a given calendar year. In 2017, IEEE TEMS initiated its flagship conference TEMSCON (held in Silicon Valley), which serves as rebranding from its original International Technology Management Conferences (ITMC). Following that, in 2018, two more conferences were initiated globally, one in Asia known as IEEE TEMS International Symposium on Innovation and Entrepreneurship (ISIE), and one in Europe as IEEE TEMS International Conference on Technology and Entrepreneurship (ICTE). For this special issue, we invited authors attending any of the three aforementioned conferences in 2018 to submit full manuscripts for reviews, and the present special issue with eleven papers is the result of a careful selection following our usual rigid double-blinded peer-review process.",

author = "Quan, {Xiaohong Iris} and {von Zedtwitz}, Max",

year = "2021",

month = dec,

doi = "10.1109/TEM.2021.3053849",

language = "English",

volume = "68",

pages = "1543--1545",

journal = "IEEE Transactions on Engineering Management",

issn = "0018-9391",

publisher = "IEEE",

number = "6",

}

TY - JOUR

T1 - Guest Editorial: Special Issue Based on Papers Submitted to All 2018 IEEE TEMS Conferences

AU - Quan, Xiaohong Iris

AU - von Zedtwitz, Max

PY - 2021/12

Y1 - 2021/12

N2 - The papers in this special issue were submitted to all the conferences organized by IEEE Technology and Engineering Management Society (TEMS) in a given calendar year. In 2017, IEEE TEMS initiated its flagship conference TEMSCON (held in Silicon Valley), which serves as rebranding from its original International Technology Management Conferences (ITMC). Following that, in 2018, two more conferences were initiated globally, one in Asia known as IEEE TEMS International Symposium on Innovation and Entrepreneurship (ISIE), and one in Europe as IEEE TEMS International Conference on Technology and Entrepreneurship (ICTE). For this special issue, we invited authors attending any of the three aforementioned conferences in 2018 to submit full manuscripts for reviews, and the present special issue with eleven papers is the result of a careful selection following our usual rigid double-blinded peer-review process.

AB - The papers in this special issue were submitted to all the conferences organized by IEEE Technology and Engineering Management Society (TEMS) in a given calendar year. In 2017, IEEE TEMS initiated its flagship conference TEMSCON (held in Silicon Valley), which serves as rebranding from its original International Technology Management Conferences (ITMC). Following that, in 2018, two more conferences were initiated globally, one in Asia known as IEEE TEMS International Symposium on Innovation and Entrepreneurship (ISIE), and one in Europe as IEEE TEMS International Conference on Technology and Entrepreneurship (ICTE). For this special issue, we invited authors attending any of the three aforementioned conferences in 2018 to submit full manuscripts for reviews, and the present special issue with eleven papers is the result of a careful selection following our usual rigid double-blinded peer-review process.

U2 - 10.1109/TEM.2021.3053849

DO - 10.1109/TEM.2021.3053849

M3 - Editorial

SN - 0018-9391

VL - 68

SP - 1543

EP - 1545

JO - IEEE Transactions on Engineering Management

JF - IEEE Transactions on Engineering Management

IS - 6

M1 - 9520682

ER -